18/06/2026
COB 0.9 Display aging test ongoing ,features as below :
1. Full flip-chip COB core process
Abandoning the independent lamp bead design of traditional SMD surface-mount technology, the full flip-chip COB process replaces SMD lamp beads. It is resistant to solder joint failure, physical impact, low dead lamp rate, and IP54+ dust-proof and moisture-proof protection. It is perfectly suitable for 7×24 hours high-frequency operation scenarios.
2. Image quality optimization technology matrix, presenting the ultimate vision
Multi-dimensional image quality optimization technology is created for different indoor lighting environments and viewing needs: black substrate + light-absorbing material to achieve 10000:1 contrast ratio, 22-bit grayscale + color calibration, no graininess, no color difference. No graininess when viewed at close range.
3. Efficient heat dissipation and energy-saving design reduce full-cycle costs
Heat dissipation and energy saving: Metal substrate + intelligent temperature control, the screen temperature drops by 3~5°C, and the power consumption is 15% lower than the traditional solution at the same brightness. Combined with the extremely low failure rate, it greatly reduces post-maintenance and energy consumption costs, meeting the green energy saving needs of enterprises.
4. Standardized and modularized, improving adaptation flexibility
The core promotion product "COB channel module (320×160mm)" adopts a standard hole design and is perfectly compatible with the mainstream male model cabinets on the market. It can be quickly assembled without additional customized cabinets, greatly shortening the project delivery cycle. The module supports seamless splicing technology, and the entire screen can be spliced without obvious gaps. Whether it is a small conference room screen or an oversized exhibition hall screen, it can achieve an integrated visual effect.
